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Brand: Molex
Industry Focus: Data
Product Type: Connctors/Cables/Terminal Blocks

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May 3, 2021

Molex is scaling global deployments of its high-speed copper and optical interconnects and modules to help customers better address demands for higher bandwidth. Molex’s broad portfolio of next-generation connectivity solutions leverage the latest advancements in copper and optics to deliver high signal integrity, lower latency and reduced insertion loss for optimal efficiency, speed and density.

Gartner expects end-user spending on global data center infrastructure to reach $200 billion this year, as large enterprise facilities resume expansion while hyperscalers continue to expand globally. Additionally, skyrocketing demand for bandwidth-intensive, data-driven services, which accelerated during COVID-19, is fueling a rise in compute, data storage and networking capabilities. To keep pace, companies are moving from monolithic data center designs to distributed and disaggregated architectures, which creates significant connectivity challenges.

“There is no such thing as ‘one size fits all’ interconnect technologies to support different applications across today’s enterprise and hyperscale data centers,” said Aldo Lopez, president, Datacom Solutions, Molex. “We offer our customers and ecosystem partners the broadest portfolio of future-proof interconnect solutions, which ease transitions to new architectures and simplify engineering development while reducing costs and time to market.”

Driving Copper Innovations with New 112G AEC Cables

Molex has added the new 112G Active Electrical Cables (AEC) to its line of copper interconnect solutions that extend link reach at higher data rates. AEC increases reach up to five meters without requiring optical cables while also supporting smaller conductors for improved cable management. AEC can also support gearbox capabilities as well as smart cable functionality for adding an extra measure of system-level redundancy.

This latest addition to the Molex copper interconnect family joins Active Copper Cable (ACC), which works just like passive cable to extend the reach of external cabling and supports low-power linear amplifier-based semiconductors for improved power management and thermal needs. Rounding out the copper lineup is Molex’s industry-leading BiPass technology, which delivers best-in-class signal integrity with multiple near-ASIC connector solutions, including TGA and the NearStack family of connectors.

Molex’s vertical BiPass implementation offers industry-leading thermal performance and low-power requirements, which let datacenters reduce their carbon footprints. BiPass also provides low latency for end-to-end channel performance while lowering TCO by reducing printed circuit board (PCB) costs.

Meeting Changing Data Center Landscape with 100G Optical Transceivers

Molex also is driving industry-wide efforts to increase adoption of 100G and 400G optical links and module technologies. The company is ramping deployment of a complete range of 100G per lambda transceivers for high-performance data center, cloud and wireless connectivity.

As part of its customer-centric and partner-focused activities, Molex supports a full IEEE- and MSA-compliant portfolio and product roadmap to meet both intra-data center interconnect, and data center interconnect requirements. The expanding optical transceiver family includes 100G-DR, 100G-FR, 100G-LR, 400G-DR4 (500m and 2km), 400G-FR4, 400G-LR4, 400G-ZR and 400G-ZR+ as well as 800G roadmap products.

Molex’s pluggable optical transceiver models all benefit from the company’s vertical-integration expertise in silicon photonics, photonic integration, module assembly and packaging. Together, these integrated capabilities and experience enable Molex to deliver optimized data rates and low power consumption in a small form factor.

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https://www.molex.com/molex/news/display_news.jsp?channel=New&channelId=-8&oid=2841&pageTitle=Molex+Scales+Deployments+of+High-Speed+Interconnect+Solutions+to++Meet+Next-Generation+Hyperscale+and+Enterprise+Data+Center+Demands

 

Editor's Pick: Featured Product News


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Extremely space-saving and flexible

The C60xx series of scalable ultra-compact Industrial PCs combines maximum computing power in what is currently the most compact format with a wide range of options for installation in the control cabinet. It is ideally suited for control, visualization and communication, for example into the cloud.

The latest Intel processors − in three different performance classes, from the Intel Atom with one core to the Intel Core i7 with eight cores – offer maximum scalability and power density with an optimal price-performance ratio.

Performance classes and application areas

The C601x series offers Intel Atom computing power for a wide range of automation and visualization tasks. Due to their impressive computing power in relation to their size, the PCs are mainly suited for use in Industrie 4.0 applications, for example as an IoT gateway.

The C603x series unites high-performance Intel Core-i processors with extremely compact housing dimensions. The processors from the 65 W class have only been used in the much larger ATX-based Industrial PCs up to now. The devices thus represent a new dimension in terms of power density. They are suitable above all for particularly complex automation and visualization tasks, but also for a wide range of other applications in the field of image processing, the handling of large volumes of data and in the IoT environment.

The C602x series is the link between the C601x and the C603x, and the fanless integration of Intel Core-i-U processors of the 15 W class opens up new application areas and options.

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TE Connectivity has recently upgraded its rugged, high-speed Mezalok mezzanine connector family to support the growing demand for higher data rates and improved processing power in military electronics. The upgraded connectors have increased data rate support up to 32+ Gb/s. The Mezalok connector family has been designed specifically for mezzanine cards in rugged applications and is standardized as the interconnect for XMC 2.0 (VITA 61). Rapidly evolving technologies in signal intelligence, radar, communications and surveillance are driving the need for more powerful embedded computing solutions. 

Mezzanine cards are often used to provide additional functionality and processing capability within a small form factor. TE designed the Mezalok connector family to support these applications. Typical applications include application-specific high-speed input/output (I/O) protocols, graphics, memory and digital-signal processing.

“New designs in rugged embedded computing require higher speeds and high pin counts in order to pack more functionality into smaller plug-in modules,” said Jason Dorwart, product manager for TE’s Aerospace, Defense and Marine division. “TE recognizes this trend and is continuing to build on this platform to help solve customer needs, offering new options in stack height, pin density and higher speeds, giving the system designer a broader solution set to work with when needing a fast, rugged and reliable mezzanine connector for extreme environments.” 

TE’s highly reliable Mezalok mezzanine connectors more than double the speed and durability of competing technology, making it one of the most viable options for today’s military and commercial aerospace applications.

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For their next meeting with an OEM or system integrator, can panel builders simply grab their smartphone and project the digital prototype of a control cabinet onto the desk of the managing director? Or right into the customer’s production facility? This admittedly sounds fantastical – but is already a reality. The new augmented reality (AR) add-on for the EPLAN eVIEW Free cloud software, in combination with the free Vuforia app from PTC, enables the free projection of completely assembled control cabinet into virtual space.

With EPLAN eVIEW Free AR, a new augmented reality (AR) application, EPLAN now brings the digital twin wherever users happen to find themselves. Designers can share their 3D designs of the control cabinet layout from EPLAN Pro Panel with co-workers and business partners via the cloud. EPLAN Program Manager Digitalisation Tim Oerter oversees the development of AR solutions and explains how to get started with EPLAN eVIEW Free AR: “A control cabinet is constructed in EPLAN Pro Panel and subsequently uploaded to the EPLAN ePULSE cloud environment. This makes it possible to share 3D designs with other users within an ePULSE organisation.” This also automatically generates both a link and a QR code that can be forwarded to the desired recipients. They can then use their smartphone or tablet computer to scan the code using the gratis app Vuforia View from PTC. Now the 3D design can be displayed anywhere using the camera of the end device – and can thus be projected onto a desktop or in the production environment as examples. Changes can also be made by touching any control cabinet components: simply tap the component and the system opens the 2D view of the schematics, for instance for further finetuning using the redlining and greenlining functions.

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