Beyond Liquid Cooling: Boyd Acquires Durbin Group, Strengthening AI Cooling Innovation Capabilities
August 6, 2024
Boyd Acquires the Durbin Group to Enhance its Liquid Cooling System Technology Portfolio with Advanced Two-Phase Liquid Cooling Capabilities that Address Thermal Requirements of Next-Generation AI Processors
Boyd’s latest acquisition, the Durbin Group, strengthens Boyd’s innovation capabilities in liquid cooling system technologies critical for high-performance compute, artificial intelligence (AI), and advanced data centers. Boyd has solved thermal challenges in data centers since the advent of microprocessors. Boyd’s latest thermal innovations in liquid cooling have helped its customers accelerate their rapid transition from traditional air cooled to liquid cooled racks.
Boyd has extensive liquid system design experience having shipped over 40 thousand liquid cooling systems to high-performance compute, hyperscaler, and semiconductor customers. Boyd also designs and manufactures liquid cold plates which cool processors and complement the liquid cooling system. To date, Boyd has shipped to key enterprise customers over 4 million liquid cold plates incorporated into 1 million liquid loops.
The Durbin Group has a long, trusted history designing advanced liquid cooling systems for enterprise, aerospace, and defense markets. These systems cool high-performance compute, power conversion, and directed energy applications. The latest AI, defense, and data center applications require single-phase liquid cooling technology, but next-generation designs require even more sophisticated two-phase liquid cooling technologies. The Durbin Group’s expertise and heritage in single and two-phase liquid cooling systems will enhance Boyd’s development efforts to address current and next-generation thermal management needs.
“We’re investing in strong engineering talent to expand Boyd’s liquid system design capacity and accelerate our liquid cooling system development. Significant market growth in high-performance data centers and artificial intelligence will continue for the foreseeable future, and this demand requires liquid cooling to scale,” said Boyd CEO Doug Britt. “We are a global leader in the design and manufacturing of liquid systems, cold plates and liquid cooling loops that directly cool high-power microprocessors. Our liquid cooling systems have cooled high-reliability semiconductor, defense, and medical applications for decades. We are well positioned to deliver complete, optimized, leak-free liquid cooling systems to AI customers at scale.”
