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Thursday 27 May 2021
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Editor's Pick: Featured Product News


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Extremely space-saving and flexible

The C60xx series of scalable ultra-compact Industrial PCs combines maximum computing power in what is currently the most compact format with a wide range of options for installation in the control cabinet. It is ideally suited for control, visualization and communication, for example into the cloud.

The latest Intel processors − in three different performance classes, from the Intel Atom with one core to the Intel Core i7 with eight cores – offer maximum scalability and power density with an optimal price-performance ratio.

Performance classes and application areas

The C601x series offers Intel Atom computing power for a wide range of automation and visualization tasks. Due to their impressive computing power in relation to their size, the PCs are mainly suited for use in Industrie 4.0 applications, for example as an IoT gateway.

The C603x series unites high-performance Intel Core-i processors with extremely compact housing dimensions. The processors from the 65 W class have only been used in the much larger ATX-based Industrial PCs up to now. The devices thus represent a new dimension in terms of power density. They are suitable above all for particularly complex automation and visualization tasks, but also for a wide range of other applications in the field of image processing, the handling of large volumes of data and in the IoT environment.

The C602x series is the link between the C601x and the C603x, and the fanless integration of Intel Core-i-U processors of the 15 W class opens up new application areas and options.

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TE Connectivity has recently upgraded its rugged, high-speed Mezalok mezzanine connector family to support the growing demand for higher data rates and improved processing power in military electronics. The upgraded connectors have increased data rate support up to 32+ Gb/s. The Mezalok connector family has been designed specifically for mezzanine cards in rugged applications and is standardized as the interconnect for XMC 2.0 (VITA 61). Rapidly evolving technologies in signal intelligence, radar, communications and surveillance are driving the need for more powerful embedded computing solutions. 

Mezzanine cards are often used to provide additional functionality and processing capability within a small form factor. TE designed the Mezalok connector family to support these applications. Typical applications include application-specific high-speed input/output (I/O) protocols, graphics, memory and digital-signal processing.

“New designs in rugged embedded computing require higher speeds and high pin counts in order to pack more functionality into smaller plug-in modules,” said Jason Dorwart, product manager for TE’s Aerospace, Defense and Marine division. “TE recognizes this trend and is continuing to build on this platform to help solve customer needs, offering new options in stack height, pin density and higher speeds, giving the system designer a broader solution set to work with when needing a fast, rugged and reliable mezzanine connector for extreme environments.” 

TE’s highly reliable Mezalok mezzanine connectors more than double the speed and durability of competing technology, making it one of the most viable options for today’s military and commercial aerospace applications.

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