nVent Announces Strategic Agreement With CoolIT Systems, Providing New Levels of Rack-Level Liquid Cooling for the Data Center Industry
![PBUS-25-nVent-CoolITLogo-400.jpg](https://www.panelbuilderus.com/wp-content/uploads/2021/03/PBUS-25-nVent-CoolITLogo-400.jpg)
March 4, 2021
nVent Electric plc recently announced a strategic alliance agreement with CoolIT Systems Inc., a global provider of modular, scalable data center liquid cooling technology. With the integration of products from CoolIT and nVent HOFFMAN and SCHROFF brands, customers will have complete and reliable high-density liquid cooled enclosure protection solutions. Both parties remain independently owned and operated.
As millions of data servers are installed worldwide each year, heat density of equipment in high-performance data centers continues to drive the needs for more efficient and effective cooling technologies. Together, nVent and CoolIT will provide complete high-density liquid cooling solutions for data center, hyperscale and edge computing applications.
“Liquid cooling has become the new standard for scalable, energy-efficient data center deployments,” said Patrick McGinn, Executive Vice President of Business Operations at CoolIT Systems. “This commercial partnership with nVent positions CoolIT to better serve the data center industry with deep combined knowledge and the ability to provide comprehensive designs, solutions and services to our customers.”
“CoolIT’s technology complements nVent’s liquid cooling product offering, and provides customers with solutions from outside the rack all the way to the chip,” said Joe Ruzynski, president of Enclosures for nVent. “This alliance marks a new chapter in our data center cooling evolution, and presents compelling growth opportunities for both companies.”